MICL in-house FA services include:

Specialized micro CNC services for Package and Die level De-processing

• Downsize and precision sectioning for a wide range of materials: hard soft or brittle

• Parallel delayering and parallel polishing revealing through the structure

Laser de-capsulation

Jet Etch – wet etch chemical de-capsulation

• Demo – System and Process Demonstration for evaluation and feasibility

Please contact us for more details.

Cu Bond Decapsulation

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