{"id":5235,"date":"2022-10-22T03:08:27","date_gmt":"2022-10-22T00:08:27","guid":{"rendered":"https:\/\/micl.co.il\/product\/jet-etch-cu-protect"},"modified":"2022-10-22T22:35:20","modified_gmt":"2022-10-22T19:35:20","slug":"jet-etch-cu-protect","status":"publish","type":"product","link":"https:\/\/www.micl.co.il\/product\/jet-etch-cu-protect","title":{"rendered":"Jet Etch CU Protect Nisene"},"content":{"rendered":"

The Old Methods<\/strong><\/span><\/span><\/p>\n

Historically, one would use an automated chemical decapsulation system to etch samples with copper wires \u2014 with minimal success.
\nEven with a low-temperature nitric and sulfuric acid mixture, and even in combination with laser pre-opening, this process works to an extent but is largely unreliable.
\nWhen faced with a limited number of field failures, which is a common scenario in a failure analysis laboratory setting, less reliable processes can\u2019t be counted on to deliver satisfactory failure analysis and visual inspection results.<\/p>\n

The Solution<\/span><\/strong><\/span><\/p>\n

To support manufacturers in making this shift so that failure analysis can still be performed on their most advanced and cutting-edge products which now use copper wire bonding, Nisene Technology Group has developed a version of its new JetEtch Pro decapsulation system that is specifically designed to handle the processing of this sensitive material: the JetEtch Pro CuProtect \u2014 the latest in a series of innovative solutions for the failure analysis industry from Nisene<\/strong>.<\/p>\n

The Process<\/span><\/strong><\/span><\/p>\n

\"cuprotect-principle-illustration\"<\/a><\/p>\n

 <\/p>\n

Using a proprietary and patented process, the JetEtch Pro CuProtect applies a bias to the solution being pumped to the sample in the process chamber.
\nThis bias creates a condition in which negatively-charged sulfate ions are attracted and temporarily bonded to the surface of the copper wire while the sample is being etched.
\nThis temporary sulfate ion coating protects the copper wires from corrosion while the sample undergoes the etching process.<\/p>\n

The image to the right illustrates the operating principle behind the technique. Click on the image to open a larger version in a new window.<\/p>\n

In less sophisticated systems relying solely on low-temperature etching, positively-charged hydrogen ions are attracted to the copper wires, thereby making the wires susceptible to pitting, cracking, breaking, and many other undesirable anomalous artifacts that greatly affect or even squelch completely the ability to perform failure analysis after the etching process.
\nThe Nisene Technology Group CuProtect system solves this problem.<\/p>\n

The Results<\/span><\/strong><\/span><\/p>\n

As illustrated in the images below, the advanced bias application process yields results that are unmatched in the industry.<\/p>\n

\"Copper<\/a><\/p>\n

If you would like to see more examples of samples etched with the CuProtect<\/strong>, please contact us<\/a>.<\/p>\n

 <\/p>\n

The Software<\/strong><\/span><\/span><\/p>\n

\u201cSurely something like this must be complicated to use and difficult to understand \u2014 right?\u201d you ask. The answer to that is \u201cof course not!\u201d The system appears on the outside to be the same as the JetEtch Pro, but there is an added line in its decapsulation programming menu that allows the user to change the value of the applied bias. The range is 0 V (off or no bias) to 20.0 V, selectable in .1 V increments. The other differences between the CuProtect system and the JetEtch Pro \u2014 both in hardware and software \u2014 are hidden inside the system, so operating the CuProtect is exactly like JetEtch Pro and virtually transparent to a user. That is to say: the learning curve is very small. There\u2019s no need to learn anything new other than how much voltage to apply to your sample while it is etching.<\/p>\n

\"jetetch-cuprotect-screen\"<\/a><\/p>\n

One additional parameter line. Not much to learn here!<\/p>\n

The Price<\/strong><\/span><\/span><\/p>\n

Much like our JetEtch Pro, the pricing of this high-end system is competitive with anything else you\u2019ll find in the market. As with the JetEtch Pro, if you find a comparable product out there that has better pricing than our system, we\u2019ll meet or beat its price.<\/p>\n

Please contact us for further details<\/span><\/strong><\/span><\/p>\n","protected":false},"excerpt":{"rendered":"

Protecting Those Sensitive Copper Wires.<\/span><\/strong><\/span><\/p>\n

With the price of gold at an all-time high, a current trend in the manufacturing of integrated circuits is the shift from gold to copper bond wires.
\nWith this shift, the failure analyst of these processors is now challenged to successfully attain package decapsulation by the use of traditional methods.<\/p>\n

Main Features Include:<\/span><\/strong><\/span><\/p>\n