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Tech Cut 4 Precision Low Speed Saw

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Tech Cut 5 Precision High Speed Saw

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Tech Cut 5 Precision High Speed Saw

TECHPRESS 3™ MOUNTING PRESS

TECHPRESS 3™ MOUNTING PRESS

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TEM Cross-Section Consumables Kit

Transparent Thermoplastic Powder, 25 lb. (11.5 kg)

Transparent Thermoplastic Powder, 25 lb. (11.5 kg)

Transparent Thermoplastic Powder, 5 lb. (2.3 kg)

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Trim Saw 2

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Trim Saw 2

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TwinPrep 5™ Grinder/Polisher

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TwinPrep 5™ Grinder/Polisher

Wafer Holding Fixture, 150 mm Ø x 3 mm T, X-Prep®

Wafering Blade, CBN Metal Bond, 4″ X .012″ X ½” (102 x 0.31mm)

Wafering Blade, CBN Metal Bond, 5″ X .015″ X ½” (127 x 0.38 mm)

Wafering Blade, CBN Metal Bond, 6″ x .020″ x ½” (152 x 0.51mm)

Wafering Blade, CBN Metal Bond, 7″ x .025″ x ½” (178 x 0.64mm)

Wafering Blade, CBN Metal Bond, 8″ X .030″ X ½” (203 x 0.76mm)

Wafering Blade, CBN Resin Bonded, 5″ X .020″ X ½”

Wafering Blade, CBN Resin Bonded, 6″ X .020″ X ½”

Wafering Blade, CBN Resin Bonded, 7″ X .025″ X ½”

Wafering Blade, CBN Resin Bonded, 8 X .030″ X ½”

Wafering Blade, Diamond Metal Bond, High Concentration, 3″ x 0.006″ x ½” (76 x 0.15 mm)

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MICL supports the Semiconductor, Military, and Microelectronics industries, as well as a wide range of R&D industries. In addition, MICL supports ALL local Academic and Nano Development centers.

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