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Wafering Blade, Diamond Metal Bond, Low Concentration, 3″ x 0.006″ x ½” (76 x 0.15mm)

Wafering Blade, Diamond Metal Bond, Low Concentration, 4″ x 0.012″ x ½” (102 x 0.31mm)

Wafering Blade, Diamond Metal Bond, Low Concentration, 5″ x 0.015″ x ½” (127 x 0.38mm)

Wafering Blade, Diamond Metal Bond, Low Concentration, 6″ x 0.020″ x ½” (152 x 0.51mm)

Wafering Blade, Diamond Metal Bond, Low Concentration, 7″ x 0.25″ x ½” (178 x 0.64mm)

Wafering Blade, Diamond Metal Bond, Low Concentration, 8″ x 0.030″ x ½” (203 x 0.76mm)

Wafering Blade, Diamond Resin Bond, 4″ X .020″ X ½” (102 x 0.51 mm)

Wafering Blade, Diamond Resin Bond, 5″ X .020″ X ½” (127 x 0.51mm)

Wafering Blade, Diamond Resin Bond, 6″ X .020″ X ½” (152 x 0.51 mm)

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MICL supports the Semiconductor, Military, and Microelectronics industries, as well as a wide range of R&D industries. In addition, MICL supports ALL local Academic and Nano Development centers.

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