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Abrasive Cut-Off Blade, CBN Resin Bonded, 10″ x 0.050″ x 1.25″ arbor (32 mm)

Abrasive Cut-Off Blade, CBN Resin Bonded, 12″ x 0.062″ x 1.25″ arbor (32 mm)

Abrasive Cut-Off Blade, CBN Resin Bonded, 14″ x 0.062″ x 1.25″/32mm arbor

Abrasive Cut-Off Blade, Diamond Metal Bonded, 10″ x 0.050″ x 1.25″ arbor (32 mm)

Abrasive Cut-Off Blade, Diamond Metal Bonded, 12″ x 0.062″ x 1.25″ arbor (32 mm)

Abrasive Cut-Off Blade, Diamond Resin Bonded, 10″ x 0.050″ x 1.25″ arbor (32 mm)

Abrasive Cut-Off Blade, Diamond Resin Bonded, 12″ x 0.062″ x 1.25″ arbor (32 mm)

Abrasive Cut-Off Blade, Diamond Resin Bonded, 14″ x 0.062″ x 1.25″/32mm arbor

Deli-Cut, Low Speed Cutting Fluid, 128 oz. (3.8 L)

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Diamond Band Saw

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Diamond Band Saw

Diamond Wafering Blade, Dia-Cut, Continuous Rim, 4″ X .020″ X ½”

Diamond Wafering Blade, Dia-Cut, Continuous Rim, 5″ X .020″ X ½”

Diamond Wafering Blade, Dia-Cut, Continuous Rim, 6″ X .015″ X ½”

Diamond Wafering Blade, Dia-Cut, Continuous Rim, 6″ X .020″ X ½”

Diamond Wafering Blade, Dia-Cut, Continuous Rim, 6″ X .040″ X ½”

Diamond Wafering Blade, Dia-Cut, Continuous Rim, 8″ X .025″ X ½”

Diamond Wafering Blade, Dia-Cut, Segmented Rim, 4 x 0.008″ x 1/2″

Diamond Wafering Blade, Dia-Cut, Segmented Rim, 4 x 0.020″ x 1/2″

Diamond Wafering Blade, Dia-Cut, Segmented Rim, 6 x 0.010″ x 1/2″

Diamond Wafering Blade, Dia-Cut, Segmented Rim, 6 x 0.020″ x 1/2″

Diamond Wafering Blade, Dia-Cut, Segmented Rim, 6 x 0.040″ x 1/2″

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Dicing Blade, 6 Micron, 3″ OD x .010″ x 1½” ID

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Dicing Blade, M/B, 8 µm Diamond, 4.6” OD x 0.006” x 3.5″ ID

Dressing Stick, Silicon Carbide, 2½” L x ½” x ½” (Pk/4)

Dressing Stick, Silicon Carbide, 6″ X ½” X ½”

Dressing Stick, Silicon Carbide, 6″ X ½” X ½”

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Flange for 60-14XX Series Dicing Wheels, 4.3″ OD x 1/2″ ID

Low Speed Cutting Fluid, High Viscosity 32 oz. (950 mL)

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Metal Bond Diamond Dicing Blade, 12 micron, 3″ x .007″ x 1½”

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Tech Cut 4 Precision Low Speed Saw

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Tech Cut 4 Precision Low Speed Saw

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Tech Cut 5 Precision High Speed Saw

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Tech Cut 5 Precision High Speed Saw

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Trim Saw 2

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Trim Saw 2

Wafering Blade, CBN Metal Bond, 4″ X .012″ X ½” (102 x 0.31mm)

Wafering Blade, CBN Metal Bond, 5″ X .015″ X ½” (127 x 0.38 mm)

Wafering Blade, CBN Metal Bond, 6″ x .020″ x ½” (152 x 0.51mm)

Wafering Blade, CBN Metal Bond, 7″ x .025″ x ½” (178 x 0.64mm)

Wafering Blade, CBN Metal Bond, 8″ X .030″ X ½” (203 x 0.76mm)

Wafering Blade, CBN Resin Bonded, 5″ X .020″ X ½”

Wafering Blade, CBN Resin Bonded, 6″ X .020″ X ½”

Wafering Blade, CBN Resin Bonded, 7″ X .025″ X ½”

Wafering Blade, CBN Resin Bonded, 8 X .030″ X ½”

Wafering Blade, Diamond Metal Bond, High Concentration, 3″ x 0.006″ x ½” (76 x 0.15 mm)

Wafering Blade, Diamond Metal Bond, High Concentration, 4″ x 0.012″ x ½” (102 x 0.31 mm)

Wafering Blade, Diamond Metal Bond, High Concentration, 4″ x 0.012″ x ½” (102 x 0.31 mm)

Wafering Blade, Diamond Metal Bond, High Concentration, 5″ x 0.015″ X ½” (127 x 0.38 mm)

Wafering Blade, Diamond Metal Bond, High Concentration, 5″ x 0.015″ X ½” (127 x 0.38 mm)

Wafering Blade, Diamond Metal Bond, High Concentration, 6″ x 0.020″ x ½” (152 x 0.51mm)

Wafering Blade, Diamond Metal Bond, High Concentration, 7″ x 0.25″ x ½” (178 x 0.64mm)

Wafering Blade, Diamond Metal Bond, High Concentration, 8″ x 0.030″ x ½” (203 x 0.76mm)

Wafering Blade, Diamond Metal Bond, Low Concentration, 3″ x 0.006″ x ½” (76 x 0.15mm)

Wafering Blade, Diamond Metal Bond, Low Concentration, 4″ x 0.012″ x ½” (102 x 0.31mm)

Wafering Blade, Diamond Metal Bond, Low Concentration, 5″ x 0.015″ x ½” (127 x 0.38mm)

Wafering Blade, Diamond Metal Bond, Low Concentration, 6″ x 0.020″ x ½” (152 x 0.51mm)

Wafering Blade, Diamond Metal Bond, Low Concentration, 7″ x 0.25″ x ½” (178 x 0.64mm)

Wafering Blade, Diamond Metal Bond, Low Concentration, 8″ x 0.030″ x ½” (203 x 0.76mm)

Wafering Blade, Diamond Resin Bond, 4″ X .020″ X ½” (102 x 0.51 mm)

Wafering Blade, Diamond Resin Bond, 5″ X .020″ X ½” (127 x 0.51mm)

Wafering Blade, Diamond Resin Bond, 6″ X .020″ X ½” (152 x 0.51 mm)

Wafering Blade, Diamond Resin Bond, 7″ X .025″ X ½” (178 x 0.64mm)

Wafering Blade, Diamond Resin Bond, 8″ X .030″ X ½” (203 x 0.76mm)

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