It Works. Here’s How
The PlasmaEtch decapsulation system is a revolutionary patented gas-based semiconductor etching system (US patent number 9,548,227).
Employing a never-before-seen application of microwaved gases inciting chemical radicals for isotropic etching, the PlasmaEtch is the greenest and most cost-effective etching solution available.
Using microwave-induced plasma — or MIP — etching, the PlasmaEtch can decapsulate most sample sizes, encapsulant types, and wire bond types.
Whether it’s a more traditional gold wire sample, or if the sample features copper or silver wires, the PlasmaEtch delivers a safe and reliable etch.
Plasma Etch Innovations:
- Afterburner Downstream Focused Plasma Etching
- Mass Flow Controlling for All Gases
- No Microwave Radiation Exposure to Samples During Etch Process
- Low-Temperature Etching
- Isotropic Etching
Unlike typical and less sophisticated plasma decap systems that take many hours or even days to get to the surface of the die, the PlasmaEtch can clear the encapsulant of most package types and reveal the complete die surface and wire sweep in a matter of a couple of hours. Chemical-free decapsulation has never been so effective.
Other MIP systems out there rely heavily on the usage of ultrasonication as part of their process. The PlasmaEtch’s MIP etching is such that it uses carefully programmed recipes with high-accuracy mass flow controllers (MFC) in conjunction with a process chamber at vacuum to remove encapsulant in a fast and effective way – without the need for ultrasonic or any additional processes!
- Highly Customizable Etch Recipes
- Etches a Wide Variety of Package Types
- Completely Chemical-free Decap
- Touchscreen Interface
- PC/Windows-based GUI
- The Only Solution for Silver Wires
- Etches Samples with All Wire Types
- Small Footprint Suited for Tabletop
Please contact us for further details